Can a blank board be used to make a reflow profile board?

 First of all, of course, to get the real furnace temperature curve! It should be said that it is necessary to obtain the actual temperature curve of the PCB board in the reflow oven because the temperature setting of the reflow oven and the actual temperature on the board have a large gap (about 10 ~ 30 °C difference), just Similar to cooking food in a gas stove, the temperature of the stove is different from the real temperature of the ingredients. By measuring the actual temperature of the PCB board, the temperature setting of the furnace can be fed back, optimized, and corrected to achieve the purpose of meeting the required temperature curve.

Of course, it is better to have PCBs full of components. The final effect of the light board may differ greatly from the actual PCBA, so it is not recommended to use the light board.

I have seen several production principles of temperature measuring boards. Some factories will scrap 1pcs PCBA as a temperature measuring board, this effect is, of course, the best; others will also scrap PCBA, but there are only components to be tested on the scrapped PCBA, which can save a part of the material cost; the one I saw recently Kind of, directly use PCBA similar to the product to be tested as a temperature measuring board. I personally think that the data measured by this method is much different from the actual furnace temperature.

In the actual process, on-site engineers are often limited by resources and cannot obtain the physical PCBA as a temperature measuring board. So is there an empirical formula that can be used? Only need PCB Gerber to calculate the furnace temperature? Remember that Flextronics seems to have such a method.