Why do I need to perform the PCB layer?

 The overlapping layer refers to a collection of copper layers and PCB insulating layers before finalizing the circuit board design. It is necessary to be compact electronic products, which is why the PCB layer stacked in the electronics field is crucial. In order to make electronic products have a compact design, designers believe that PCBs containing a multi-layered design and 3D appearance need to be installed. Multi-layers help improve the board's ability to distribute energy, high-speed support signals, eliminate electromagnetic interference, and minimize cross-interference.

Why do I need to perform the PCB layer?

1. Continuous development

As the current technology is becoming more and more developed, the requirements of electronic products have become higher and higher. I hope PCB is small and light, and also hope to have better functionality and reliability and longer life. This will lead to multilayer PCBs.

Stack two or more single-sided and/or double-sided PCBs together, and generate multilayer PCBs with reliable predefined meaning between them. There are three or more conductive layers in a multilayer PCB. There are two layers outside, and the insulation board synthesizes one layer. As PCB complexity and density increase, when the design efficiency of the layers is low, some problems may occur, such as noise, band capacitors and stringing.

2. The PCB stack layer is one of the most important factors in determining EMC performance.

The PCB layer is one of the most important factors in determining the performance of the product's electromagnetic compatibility (EMC). The carefully designed overlapping layer minimizes radiation and prevents the circuit from being disturbed by external noise sources. It can also reduce problems such as signal string and impedance.

However, the inferior layer can cause EMI (electromagnetic interference) radiation to rise, because the impedance does not match the reflection and bell in the system to significantly reduce the performance and reliability of the product.

3. PCB stack layer can maintain signal integrity.

The PCB layer may be designed to include features that help maintain signal integrity. The maximum capacitance decoupling in the power distribution network is achieved by directly placing the ground layer in the stack layer. The signal layer or PCB layer should always have an adjacent ground floor to the PCB layer. Each signal layer includes a grounding plane to enhance the magnetic flux to eliminate and eliminate noise. The spacing between the minimized PCB guide layer will increase the volume offset.

High-speed wiring is the best wire wiring, which uses the shielding and magnetic flux of the inner layer of the adjacent ground floor to the greatest extent. Less sensitive trace wires with a low risk of air coupling are the best wiring on the outer layer of the printed circuit board. Further wiring technology combines the vertical ratio of the chassis connection with each ground pin. Ground filling between the outer wiring with a large number of ground pins can provide the return path and reduce circuit current generation.

4. Avoid discontinuous and loop circuit PCB layer

The plane layout diagram is used to reduce radio frequency energy. The plane layout diagram can avoid unnecessary impedance and unnecessary materials, such as too thick copper weight. Design the PCB layer to eliminate impedance accumulation and divert radio frequency energy to the chassis. Path signal to ensure that the return path is directly below the signal line. Avoid circulation that generates impedance when there is a fast switch signal on PCB.

Assess the PCB layer when placing a buried hole to ensure that there is no discontinuity. The discontinuous gap will be generated in the layer plane, and the return path may be forced into the noise loop. Place a decoupling capacitor on the power rail of each component to divert the switch signal to the ground, and place bypass capacitors on the switch signal entering and leaving the design of the connector that enters and leaves the design.

5. PCB laminate for capacitor decoupling and magnetic flux elimination.

The power supply layer and the ground layer are adjacent to each other to provide clean power throughout the PCB layer. When the power layer and the ground layer are adjacent to each other in the stack, the resulting low-impedance capacitance will generate a clean power distribution. By adding off-coupled capacitors to each component power supply lead connected to the PCB layer, it continues to design the integrity of the entire layer's power distribution network.

The design of the decoupling capacitance around each component power supply will provide energy to large digital networks that switch at the same time. By adding decoupled capacitors to the signal pin during the clock period, ensuring the integrity of the power distribution of the entire layer. Desert coupling and bypass capacitors provide sufficient energy to maintain the expected signal during operation to prevent accidental injection of PCB layers from rebounding and radio frequency energy.

6. PCB stack layer to avoid unwanted impedance and circuitry

The signal layer is adjacent to the ground layer to prevent radio frequency energy from ringing. When the return plane is directly next to the signal plane, the ring is not formed. Pay placement is important to avoid slots in the stack. Among them, the signal may need to be spread around the slot to generate a ring. In addition, a high-speed signal generates a general volume in the signal network and the return network.

The general volume is equal and opposite, signals and returns. Maximum offset occurs when high-speed signals and returns are directly adjacent. The magnetic flux generated by high-speed signals must be eliminated to maintain electromagnetic compatibility (EMC). Design the PCB layer to ensure that the return layer is adjacent to each signal layer to achieve electromagnetic compatibility (EMC). EMC shows that layer stacking design is to appropriately reduce magnetic flux generation.