10 guidelines for car PCB design

 In the past few decades, our road has changed. This change has become more and more intelligent. This has many benefits, including the important task of transferring operations and safety responsibilities from the driver to the car system. Many vehicles now have automatic braking systems, Such as Automatic Emergeency Braging (AEB), try to slow down the speed to avoid emergency.

More revolutionary is the autonomous vehicle on electric vehicles and highways. Although electric vehicles and automatic transmission are based on different technological progress, both are possible, and both depend on providing monitoring, control and driving circuit boards for mechanical systems that realize car functions. In this article, we will discuss 10 car PCB design guidelines to help you create high -efficiency devices.

10 guidelines for car PCB design

Your motherboard must meet the specifications specified in the relevant standards. The pursuit of meticulous design processes will prevent problems in the production process. In order to make your design more feasible, please follow the following important guidelines:

1. The direction and location of the component

The positioning and direction of this component have a great impact on the reliability, manufacturing and performance of the circuit board. You can analyze any upgrade and defect detection of the board by organizing and distinguishing components. When placing an element, please follow the following methods:

（1）Place similar components in the same direction. This will help wiring and welding operations.

（2）For fluctuations, the component should be parallel to the direction of the wave. This will avoid welded bridges or opening.

（3）Leave a large space between the inductance on the circuit board.

（4）Align the sensor into right angles. This will reduce cross talk.

（5）First place the maximum and most important components.

（6）Separate the simulation from different parts of the circuit board to digital components.

（7）Avoid placing high components (such as electrolytic capacitors) and short components. （8）This will prevent the welding point from loosening.

（9）Let high -power components stay away from other components as much as possible to optimize the heat dissipation on the motherboard.

2. Place the wire to prevent coupling

Improper wire placing will affect the combination of Magnet and may have a sense of interaction. Consider the following valid sales clue layout standards:

（1）Avoid putting the wires closer to each other.

（2）In areas with less radiation, select the return current path near the main current path. With this, you can reduce the current cycle area.

（3）Implement overall grounding under sales clues. This will improve the performance of the board.

3. Signal route in car PCB

Each layer uses two to four holes to connect to the high -current layer of conduction. This will increase reliability, reduce resistance and inductance loss, and improve guidance. Signal routing follows the following car PCB design guide:

（1）Place the power layer and ground layer in the inner layer.

（2）Use layers to protect sensitive signals from the impact of the noise source, and ensure that the transmission impedance can control the shortest and most straight routes as much as possible.

（3）For the double -layer circuit board, walk horizontally on one side and move vertically on the other side.

（4）Alternately arranged vertical and horizontal wiring multi -layer boards.

4. Effective heat management

Follow the appropriate heat management technology to dissipate heat to absorb more than 10 mW or conduct more than 10 mA. In order to better control the temperature, the following points are used:

（1）Choose the copper layer and signal over -holes as the overcare perforated to improve thermal conductivity.

（2）Put the signal's perforation at the front of the element or SMD with closer to the surface pins.

（3）Provide a radiator for high -power components.

（4）Place the metal heat sink under the thermal part of the circuit board.

（5）Solid holes can be used from keeping warm to ground planes.

（6）The circuit board uses metal core or polypenicide because they have better thermal characteristics.

（7）Multiple ground layers and power layers are adopted, and it is directly coupled to the heat source through the heat dissipation hole. This can reduce the working temperature.

（8）I prefer high TG circuit boards, because the working environment often frequently heated PCB.

5. Implement frequent design rules inspection

The running design rules check out any errors that may not meet the high -speed requirements of general manufacturing and specific applications. General DRC must:

（1）Check the appropriate spacing between the entire circuit board and the components of each layer.

（2）The distance between the power supply and the ground wire. Provide broad space for the ground line.

（3）Check whether the grounding connection of the analog and digital circuit is correct.

（4）It is recommended to modify the unnecessary lines, such as the short -term opening.

（5）Verify whether the connected layout is matched with the definition of the logical diagram.

（6）Analyze whether the outer edge of the power layer is reduced. This will avoid short circuit when the power layer is exposed.

（7）Verify signal integrity, power integrity electromagnetic interference and safety inspection.

6. Integrated car design standards

Complex and compact circuit boards will help you run information and entertainment systems, communication, security, driver assistance systems, engines and power transmission systems. The complex car design of PCB will increase the development of more advanced driverless cars as technology. Therefore, for durable car design, we must comply with IATF 16949, IPC-60123 levels, AEC-Q100, and SAE J3016_201401.

7. Installation of the ground hole

The installation hole should be plated and grounded. Various circuit impedance differences are one of the problems. This is mainly due to various electronic components and its connection. Therefore, the following guidelines can be used for car design:

1. Place the inductive module in a sensitive area near Tong Kong.

2. Use appropriate filtering networks because they depend on the hole.

3. Thin the copper on the layer. This will reduce the impact of pore parasitic inductance.

8. Optimize the radio frequency circuit.

The PCB design of the car is ideally combined with the RF circuit. For you, solving problems related to coexistence, power consumption and long -term reliability may be a challenge. Incorporate the following prompts in your design:

(1)Use very linear or front -end devices.

(2)Pay attention to the control efficiency, current use and power consumption of radio frequency front -end.

(3)Select high -performance RF filters to reduce insertion loss, temperature drift and interference.

(4)Use the component that combines the launch, receiving and filtering function into a unit.

9. Adapt to good grounding technology

When the grounding technology of planning car design:

(1)Create a single -point grounding connection for each car circuit board.

(2)Provide continuous ground areas with extremely low impedance.

(3)Connect the ground wire to the filling line with the hole array

(4)Be sure to ground the copper -plated cable.

10. Prevent electromagnetic interference in car PCB design

In any circuit, taking preventive measures to restrict measures is vital electromagnetic interference, electronic musical instrument industry, and eight -generation records. This will ensure the smooth operation of the car. By taking the following measures, you can protect your motherboard from the effect of magnetic interference:

(1)Maintain the smallest effective area of the circuit.

(2)Provide magnetic shielding for the components that are easily caused by interference.

(3)Use differential transmission signals in circuits.

(4)You can reduce network interference by using a reasonable guidance path.

(5)Increase the power filter capacitor and add an RC decoupling circuit.

(6)Using non -split appliances to ignite, eliminate interference sources, and reduce electromagnetic radiation.

(7)Hire the CAN bus protocol to reduce the heavy wiring, thereby minimizing electricity interference and EMI effects.